Damper arrangement for actuator damping

ABSTRACT

A damper arrangement may be used in a camera module that includes a first (e.g., stationary) and a second (e.g., dynamic) component. The second component may hold a lens such that the lens moves together with the second component. The damper arrangement may include an interface member that extends from the first or the second component to at least partially into a viscoelastic material within a volumetric space configured in the first component, the second component, or both. The interface member may include a mounting portion having a thickness and a viscoelastic material section, having a different thickness, that interacts with viscoelastic material to dampen motion of the second component, for example, during operation of a lens actuator to move the second component along an optical axis of the lens. The interface member may be a two-piece interface member, such as a pin soldered into a hole in a plate, for example.

BACKGROUND

This application is a continuation of U.S. patent application Ser. No.16/560,871, filed Sep. 4, 2019, which claims the benefit of U.S.Provisional Application No. 62/737,055 filed on Sep. 26, 2018, which areincorporated by reference herein in their entirety.

TECHNICAL FIELD

This disclosure relates generally to control of the motion of cameracomponents.

DESCRIPTION OF THE RELATED ART

The advent of small, mobile multipurpose devices such as smartphones andtablet or pad devices has resulted in a need for high-resolution, smallform factor cameras for integration in the devices. Some small formfactor cameras may incorporate optical image stabilization (OIS)mechanisms that may sense and react to external excitation/disturbanceby adjusting location of the optical lens on the X and/or Y axis in anattempt to compensate for unwanted motion of the lens. Some small formfactor cameras may incorporate an autofocus (AF) mechanism whereby theobject focal distance can be adjusted to focus an object plane in frontof the camera at an image plane to be captured by the image sensor. Insome such autofocus mechanisms, the optical lens is moved as a singlerigid body along the optical axis (referred to as the Z axis) of thecamera to refocus the camera.

SUMMARY OF EMBODIMENTS

Embodiments include a device and methods of making and using the device.A device includes various components (e.g., various arrangements ofdynamic, intermediate, and/or stationary components) that move withrespect to one another. An example camera device includes a firstcomponent comprising a stationary component such as a magnet holder, canor substrate, and second component comprising a dynamic component suchas a lens assembly (e.g., a lens carrier that holds one or more lensesof the camera). The second component (e.g., a dynamic lens assembly) maymove with respect to the first component (e.g., a stationary componentsuch as the magnet holder), and a damper arrangement (e.g., a volumetricspace such as a pocket or hole holding viscoelastic material and aninterface member that interacts with the viscoelastic material) maydampen the movement, in embodiments. For example, the damper arrangementmay dampen movement of the second component (e.g., one or more lensassemblies) along an optical axis of the lens elements with respect to afirst component (e.g., a magnet holder, can or substrate) or withrespect to an intermediate component, such as a magnet holder, inembodiments. Some such arrangements of components may include componentsof an auto focus assembly or an optical image stabilization assembly, inembodiments.

In some embodiments, a device may include one or more intermediatecomponents that are suspended in such a manner so as to allow movementof the intermediate components (e.g., orthogonal to, or parallel to, theoptical axis of the lens assembly). For example, intermediate componentsmay include components of an optical image stabilization assembly (e.g.,a magnet holder and magnet) and one or more components of a dampingarrangement such as an interface member. In some embodiments, componentsof an auto focus assembly may be movably suspended from the componentsof the optical image stabilization assembly that is also movablysuspended (e.g., depicted in FIG. 2 , described below). Both the OISassembly and the autofocus assembly may be suspended, in embodiments. Inembodiments, the OIS or the autofocus assemblies may be suspended fromthe other assembly.

The volumetric space may be configured in the first component,intermediate component or the second component and may comprise aviscoelastic material (e.g., gel, grease, etc.). The interface membermay extend from either the first component, intermediate component orthe second component to at least partially into the viscoelasticmaterial. In some examples, the interface member may be a rigid orsemi-rigid member. In some embodiments, one or more portions of theinterface member may be configured to flex. At least the flexibleportion of the interface member may be covered with an antivibrationmaterial such as a polymer. At least a portion of the interface member(e.g., a viscoelastic engagement element) is configured to traversewithin the viscoelastic material to dampen motion of the secondcomponent, e.g., during operation of a lens actuator to move the secondcomponent (e.g., the lens assembly) along the optical axis. Theviscoelastic material may be manufactured or processed as part of thedevice with a skin having different characteristics (e.g., an upperlayer of a different elasticity, viscosity or toughness or differentadherence to the interface member, based on gel grade or curingconditions) than the remaining viscoelastic material.

Some embodiments include a camera module. The camera module may includea lens assembly, an image sensor, and an actuator to move the lensassembly. The lens assembly includes one or more lens elements thatdefine an optical axis. A lens carrier is configured to hold the lens orlenses and move the lens or lenses along the optical axis. An actuatorassembly may include an actuator (e.g., a voice coil motor (VCM)) afirst component such as a magnet holder, a second component such as alens carrier), a suspension system for suspending the second component,and a damper arrangement configured to dampen vibrations or othermovement of the second component (e.g., the lens carrier) with regard tothe first component (e.g., the magnet holder).

In various embodiments, the damper arrangement (sometimes referred to asa damper assembly) includes a viscoelastic material and an interfacemember that interacts with, and movement of which is damped by, theviscoelastic material. The viscoelastic material may be at leastpartially disposed within a volumetric space such as a pocket or hole.The volumetric space may be defined by the first component or the secondcomponent. The interface member may extend from the stationary component(e.g., magnet holder) or the second component (e.g., lens carrier) to atleast partially into the viscoelastic material. In some examples, theinterface member may be a rigid member. Furthermore, the interfacemember may be configured to traverse within the viscoelastic material todampen motion of the lens carrier, e.g., during operation of theactuator to move the lens carrier along the optical axis.

Devices sometimes suffer from extended periods of time to focus based onparticular configurations of the damping arrangement. For example, someinterface members include a mounting section for mounting the interfacemember and a pin section that interacts with the viscoelastic materialto dampen movement. Configurations with relatively larger cross sectionpins experience a relatively higher damping coefficient (which can causean excessively-long time to focus based on slowed movement, for example)and may also experience reduced reliability (e.g., mechanically-inducedcyclic motion may cause noticeable damping degradation such a loststructural integrity of the gel—thicker pins generally create a troughin the gel, reducing contact between the gel and pin). A higher dampingcoefficient and reduced reliability may be experienced for relativelylarger cross section pins even when various different viscoelasticmaterial (e.g., gel grades) and/or curing conditions are used. Inembodiments, a pin without the edges of a stamped pin, such as acircular or elliptical cross-section pin may have various benefits suchas increased reliability in the attachment of the pin to the gel. Roundor elliptical cross-section pins may experience reduced gouging ortroughing of the gel, in embodiments. Round or elliptical cross-sectionpins may experience increased adhesion to the gel over cross sectionsthat have hard edges (e.g., the hard edges may cut or slice the gelinstead of adhere) in embodiments. In some embodiments, a smallercross-section pin may be used to introduce an amount of flexibility intothe interface to further increase reliability of the adhesion betweenthe pin and the gel. Other components may be reconfigured to compensatefor the additional flexibility of the pin, in embodiments.

Reducing the pin cross section may allow for more gel volume coverage(e.g., more room for gel in the volumetric cavity or space, and maypermit improved curing process conditions (e.g., a skin, via broadbandspectrum cure, may be produced on the top of the gel, reducingproduction of cavities in the gel and/or increasing connectivity betweenthe gel and the pin via the skin). Reliability of the dampingarrangement may also be improved by reducing the pin diameter. Forinstance, a reduced pin diameter may reduce the stress in thegel—improving robustness of the damping arrangement assembly. However,it may difficult to reduce the pin cross section to lower the dampingcoefficient while using certain manufacturing processes (e.g., punchingor stamping the interface member). For example, it may be difficult toreduce the pin diameter much below 0.1 millimeter using a punchingprocess. In some embodiments, a length of the pin may be increased toincrease the amount of surface-area contact between the pin and theviscoelastic material (e.g., FIG. 6H, described below).

Embodiments include an interface member with a mounting portion of theinterface member (e.g., a sheet or spring or plate, stamped, etched, orotherwise processed) that has a cross-section and extends from the firstcomponent or the second component. The interface member also includes aviscoelastic material portion of the interface member (e.g., a pin orwire soldered to the plate) that also has cross section and that extendsat least partially into the viscoelastic material.

In embodiments, the cross-section of the mounting portion of theinterface member is different from (e.g., greater or less than) thecross-section of the viscoelastic material portion of the interfacemember. For example, a relatively smaller diameter wire (e.g., 0.01-0.09millimeter) may be soldered to a plate or sheet, and/or the plate orsheet may be made to have a different cross section (e.g., 0.01 mm-0.09mm or other cross section). The different cross sections are obtainedvia a different manufacturing process (e.g., etching and soldering)instead of punching, in embodiments. Various configurations may mix andmatch wire diameters and cross sections to adjust characteristics of thedamping assembly. For example, a wire of a relatively larger diameter(e.g., 0.04 mm) may be soldered to a plate of a relatively smaller crosssection (e.g., 0.03 mm) or a wire of a relatively smaller diameter maybe soldered to a plate of a relatively larger cross section. Inembodiments, a smaller pin diameter may reduce stress in thegel/interface member interface by providing more gel volume coverage(e.g., less space taken by the pin makes more space for gel), and mayalso improve the gel curing process conditions.

Some embodiments add additional layers of configurability to the damperarrangement. For example, various embodiments may alter a thickness(e.g., a diameter or cross section) of either the mounting portion ofthe interface member or the cross-section of the viscoelastic materialportion of the interface member. Various embodiments may be configuredwith varying grades of viscoelastic material (e.g., various gel grades)or with various curing process conditions (e.g., spot and/or flood), forexample.

Some embodiments facilitate separate tailoring of both the wire diameterand the plate thickness to improve functional performance andreliability of the damping assembly. The ability to tailor the wirediameter and thickness of the plate may permit a broader selection ofgel grades and/or gel curing processes, in embodiments.

In some embodiments, the actuator may include a voice coil motor (VCM)actuator having one or more magnets and one or more coils. In anexample, the first component may be a magnet holder configured to holdat least one of the one or more magnets. Furthermore, in some examples,the lens carrier may hold at least one of the one or more coilsproximate the magnet(s) held by the magnet holder. In some examples, thevolumetric area (e.g., pocket, hole or the like) may be defined by oneor more surfaces of the lens carrier. In embodiments, an interfacemember extends from the magnet holder such that a portion of theinterface member is disposed within the viscoelastic material in thevolumetric area. The physical structure may be designed to intentionallyrestrict a range of motion of the lens carrier during operation of thelens actuator (e.g., based at least in part on the interface member andthe viscoelastic material). In some embodiments, the physical structureof the device may be manufactured or processed such that at least aminimum clearance is maintained, across the range of motion, between theportion of the interface member that is disposed within the viscoelasticmaterial and the one or more surfaces of the magnet holder that definethe pocket.

Some embodiments include a system. The system may include a lensassembly and an actuator to move the lens assembly with respect to oneor more stationary components of the system (e.g., a camera, a phone orthe like). The lens assembly includes one or more lens elements thatdefine an optical axis. A system may include an actuator assembly thatincludes one or more voice coil motors, a first component (e.g., astationary component) and a second component (e.g., an intermediateand/or dynamic component) variously coupled to one or more components ofthe actuator, viscoelastic material, and an interface member configuredto interact with the viscoelastic material to dampen motion or vibrationof the second component. The second component may be configured to holdthe lens and move along the optical axis. The viscoelastic material maybe disposed within a pocket defined by one or more surfaces of the firstcomponent and/or the second component. The interface member may includea first portion and a second end portion. The first portion may extendfrom the first component or the second component. The second end portionmay be disposed within the viscoelastic material. In some examples, theinterface member may be a rigid, semi-rigid, or flexible member.

In various embodiments, movement of the second component duringoperation of the actuator may be restricted (e.g., based at least inpart on the interface member and the viscoelastic material) to a rangeof motion. In some instances, the physical structure of the device maycause at least a minimum clearance to be maintained, across the range ofmotion, between the second end portion of the interface member that isdisposed within the viscoelastic material and the surface(s) that definethe pocket. In some implementations, the system may include one or moreprocessors configured to cause the actuator to move the second componentalong the optical axis. The second end portion may be configured totraverse within the viscoelastic material to dampen motion of the secondcomponent during operation of the actuator to move the lens along theoptical axis.

Some embodiments include a method of constructing a damper arrangementof an actuator. The method may include forming a second component (e.g.,a dynamic component) and/or a first component (e.g., a stationarycomponent) that defines a pocket. Furthermore, the method may includeforming an interface between the second component and the firstcomponent. In various embodiments, the interface may include aviscoelastic material and an interface member that is at least partiallywithin the viscoelastic material. In some embodiments the interfacemember may comprise two distinct sections; one section mounted to astationary or second component of the device, a second sectionconfigured to interact with the viscoelastic material. Each of the twodifferent sections of the interface member may be manufacturedseparately and then joined together. For example, the section mounted toa stationary or dynamic component of the device may be manufactured fromor include a plate, spring or other material, and the section configuredto interact with the viscoelastic material may be manufactured fromwire. The two sections may be joined together using any of varioustechniques such as soldering or the like.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A and 1B each illustrate a respective cross-sectional view of anexample camera module that includes a damper arrangement, in accordancewith some embodiments. FIG. 1A indicates piston motion of one or moredynamic components of the camera module. FIG. 1B indicates rockingmotion of one or more dynamic components of the camera module.

FIG. 2 illustrates a cross-sectional side view of another example cameramodule that includes an actuator assembly with a damper arrangement, inaccordance with some embodiments.

FIGS. 3A-3D each illustrates a respective view of another example cameramodule that includes a damper arrangement, in accordance with someembodiments. FIG. 3A illustrates an exploded perspective view of somecomponents of the camera module. FIG. 3B illustrates a perspective viewof an exterior of the camera module. FIG. 3C illustrates across-sectional top view of the camera module. FIG. 3D illustrates across-sectional top view of the camera module.

FIG. 4 illustrates a cross-sectional view of an example damperarrangement, in accordance with some embodiments.

FIG. 5 illustrates a cross-sectional view of another example damperarrangement, in accordance with some embodiments.

FIGS. 6A-6L each illustrate a respective view of example damperarrangements, in accordance with some embodiments. FIGS. 6A and 6Billustrate cross-section views of embodiments of an interface member andviscoelastic material in relation to a stationary component and a lens,according to some embodiments. FIGS. 6C-6E illustrate top-down views ofvarious embodiments of an interface member, according to someembodiments. FIGS. 6F-6H illustrate various configurations of aninterface member, according to some embodiments. FIGS. 6I-6L illustratevarious configurations of an interface member interacting withviscoelastic material, according to some embodiments.

FIG. 7 is a flowchart of an example method of constructing a damperarrangement, in accordance with some embodiments.

FIG. 8 illustrates a block diagram of a portable multifunction devicewith a camera, in accordance with some embodiments.

FIG. 9 depicts a portable multifunction device having a camera, inaccordance with some embodiments.

FIG. 10 illustrates an example computer system that may include acamera, in accordance with some embodiments.

This specification includes references to “one embodiment” or “anembodiment.” The appearances of the phrases “in one embodiment” or “inan embodiment” do not necessarily refer to the same embodiment.Particular features, structures, or characteristics may be combined inany suitable manner consistent with this disclosure.

“Comprising.” This term is open-ended. As used in the appended claims,this term does not foreclose additional structure or steps. Consider aclaim that recites: “An apparatus comprising one or more processor units. . . .” Such a claim does not foreclose the apparatus from includingadditional components (e.g., a network interface unit, graphicscircuitry, etc.).

“Configured To.” Various units, circuits, or other components may bedescribed or claimed as “configured to” perform a task or tasks. In suchcontexts, “configured to” is used to connote structure by indicatingthat the units/circuits/components include structure (e.g., circuitry)that performs those task or tasks during operation. As such, theunit/circuit/component can be said to be configured to perform the taskeven when the specified unit/circuit/component is not currentlyoperational (e.g., is not on). The units/circuits/components used withthe “configured to” language include hardware—for example, circuits,memory storing program instructions executable to implement theoperation, etc. Reciting that a unit/circuit/component is “configuredto” perform one or more tasks is expressly intended not to invoke 35U.S.C. § 112, sixth paragraph, for that unit/circuit/component.Additionally, “configured to” can include generic structure (e.g.,generic circuitry) that is manipulated by software and/or firmware(e.g., an FPGA or a general-purpose processor executing software) tooperate in manner that is capable of performing the task(s) at issue.“Configure to” may also include adapting a manufacturing process (e.g.,a semiconductor fabrication facility) to fabricate devices (e.g.,integrated circuits) that are adapted to implement or perform one ormore tasks.

“First,” “Second,” etc. As used herein, these terms are used as labelsfor nouns that they precede, and do not imply any type of ordering(e.g., spatial, temporal, logical, etc.). For example, a buffer circuitmay be described herein as performing write operations for “first” and“second” values. The terms “first” and “second” do not necessarily implythat the first value must be written before the second value.

“Based On.” As used herein, this term is used to describe one or morefactors that affect a determination. This term does not forecloseadditional factors that may affect a determination. That is, adetermination may be solely based on those factors or based, at least inpart, on those factors. Consider the phrase “determine A based on B.”While in this case, B is a factor that affects the determination of A,such a phrase does not foreclose the determination of A from also beingbased on C. In other instances, A may be determined based solely on B.

DETAILED DESCRIPTION

Some embodiments include camera equipment outfitted with a damperarrangement that may be used to dampen motion of one or more dynamiccamera components during operation of an actuator that causes motion ofthe dynamic camera components. In an example, the camera may besubjected to external disturbances during operation of the actuatorassembly to move the camera lens along an optical axis, which may inducepiston vibration and/or rocking vibration that may negatively impactcamera performance. In some instances, piston vibration may impact userexperience by generating a rattling noise and reducing camerareliability. Furthermore, rocking vibration may generate blurry imagesand cause relatively longer settling times. In various embodiments, thedamper arrangement described herein may be used to dampen and/or cancelunfavorable motion such as piston vibration and/or rocking vibration.

In some embodiments, a device includes a stationary component coupled toa portion of an actuator (e.g., an actuator that includes a fixedcomponent of the voice coil such as a magnet fixedly coupled to astationary component of the device such as a magnet holder), a dynamiccomponent coupled to portion of the actuator (e.g., an actuator thatincludes a dynamic component of the voice coil such as a coil coupled toa dynamic component of the device, such as a lens carrier) a volumetricarea such as a pocket that holds viscoelastic material (e.g., gel,grease, etc.), and an interface member arranged to interact with theviscoelastic material to dampen movement of dynamic components withinthe device. In various examples, the dynamic component may be configuredto hold one or more lens elements (e.g., a lens of a camera) and movealong an optical axis of the lens elements. The pocket may be configuredin the stationary component and/or the dynamic component. The interfacemember may extend from the stationary component or the dynamic componentto at least partially into the viscoelastic material. In some examples,the interface member may be a rigid member. Furthermore, in variousembodiments, the interface member may be configured to traverse withinthe viscoelastic material to dampen motion of the dynamic component,e.g., during operation of the lens actuator to move the dynamiccomponent along the optical axis.

In some embodiments, a device may include an intermediate component(e.g., a magnet holder) that is suspended (e.g., by an OIS springflexure) so as to allow for movement by one or more OIS actuators (e.g.,an OIC coil) of a lens assembly in a direction orthogonal to an opticalaxis of the lens assembly. In some embodiments, the dynamic componentmay be suspended from the intermediate component (e.g., one or morecomponents of an autofocus assembly may be suspended by AF upper andlower spring flexures that suspend the lens carrier from theintermediate component). A damping assembly, similar to those describedabove, may be integrated between the intermediate component and thedynamic component to dampen movement therebetween, as illustrated inFIG. 2 , described below. In some embodiments, a device may includemultiple damping component, integrated between the intermediatecomponent and the dynamic component to dampen movement therebetween, andintegrated between a stationary component and the intermediate componentto dampen movement therebetween, for example.

In some examples, the pocket may be defined by one or more surfaces ofthe dynamic, intermediate, or stationary component. The interface membermay extend from one of the components such that a portion of theinterface member is disposed within the viscoelastic material. Movementof the components during operation of the lens actuator may berestricted (e.g., based at least in part on the interface member and theviscoelastic material) to a range of motion. In some embodiments, atleast a minimum clearance may be maintained, across the range of motion,between the portion of the interface member that is disposed within theviscoelastic material and the one or more surfaces of the component thatdefine the pocket. For example, the physical structure and/orarrangement of the components of the device may be such that a minimumclearance may be maintained, across the range of motion, between theportion of the interface member that is disposed within the viscoelasticmaterial and the one or more surfaces of the component that define thepocket.

In some embodiments, the pocket is defined by one or more surfaces ofthe component that forms the pocket (e.g., a stationary, intermediate,or dynamic component). Furthermore, in some instances, the interfacemember extends from the component such that a portion of the interfacemember is disposed within the viscoelastic material.

In various examples, the actuator may comprise a voice coil motor (VCM)actuator. For instance, a VCM actuator may include one or more magnetsand one or more coils. An actuator assembly may contain one or more VCMs(e.g., pairs of VCMs acting in concert, or other arrangements ofmultiple VCMs performing distinct functions, such as an actuatorassembly for image stabilization and another actuator assembly for zoomor focus functionality. In some embodiments, a stationary component ofthe actuator assembly may be a magnet holder that is configured to holdat least one of the magnets of a VCM. Furthermore, the dynamic componentof the actuator assembly may be configured to hold at least one of thecoils of the VCM in some implementations.

In some embodiments, a device may be configured with multiplesubassemblies (e.g., see FIG. 2 , with an autofocus subassembly, anoptical image stabilization subassembly, etc.). In at least some suchembodiments, the subassemblies may be arranged such that one subassemblymoves in relationship to the other subassembly. For example, an opticalimage stabilization subassembly may be suspended from or upon one ormore fixed components of the device (e.g., suspended from a fixedsubstrate or shield can) and an autofocus subassembly may be suspendedfrom the optical image stabilization subassembly, allowing each of theassemblies to move in relation to the fixed components, and also inrelation to one another. Each of the subassemblies may be configuredwith various actuator components to control movement of thesubassemblies. The subassemblies may be arranged with one or moredamping assemblies to dampen movement between the subassemblies. In someembodiments, one or more of the subassemblies may be arranged with oneor more damping assemblies to dampen movement between the subassembliesand one or more fixed components of the device.

In some embodiments, the device may be a mobile device (e.g., a mobilemultifunction device). The mobile device may include a camera module.The lens assembly and the actuator assembly may be part of the cameramodule. The camera module may further include an image sensor configuredto capture light passing through the lens elements and convert thecaptured light into image signals. The mobile device may further includea display and one or more processors.

In some cases, the processors may be configured to cause the actuator oractuator assembly to move the dynamic component and/or the lens alongthe optical axis, e.g., to provide autofocus functionality or the like.Additionally, or alternatively, the processors may be configured tocause the actuator or actuator assembly to move the dynamic component indirections orthogonal to the optical axis and/or to cause the lensactuator to tilt the dynamic component relative to the optical axis. Insome examples, the processors may be configured to cause the display topresent an image based at least in part on one or more image signalsfrom the image sensor.

In some embodiments, a camera module may include a lens assembly, animage sensor, and an actuator assembly. The lens assembly may includeone or more lens elements that define an optical axis. The actuatorassembly may include a stationary component, a lens carrier assembly, asuspension system for suspending the lens carrier assembly, and a damperarrangement that dampens motion or vibration among the stationarycomponent and the lens carrier assembly. A lens assembly may include oneor more lens elements that define an optical axis. A lens carrier may beconfigured to hold the lens assembly and move along the optical axis.

In various embodiments, the damper arrangement may include aviscoelastic material and an interface member that interacts with thematerial. The viscoelastic material may be at least partially disposedwithin a volumetric space such as a pocket or hole. For instance, apocket may be defined by one or more surfaces of the stationarycomponent or the lens carrier. The interface member may extend from thestationary component or the lens carrier to at least partially into theviscoelastic material. In some examples, the interface member may be arigid member. Furthermore, the interface member may be configured totraverse within the viscoelastic material to dampen motion of the lenscarrier, e.g., during operation of the actuator to move the lens carrieralong the optical axis.

In some examples, the interface member may include a first portion and asecond portion. The first portion may be disposed within theviscoelastic material, and the second portion may be disposed outside ofthe viscoelastic material (e.g., as a mounting portion of the interfaceelement that mounts to a stationary component of a device and positionsthe first portion to traverse within the viscoelastic material). In someexamples, the first portion may have a first cross-sectional area, andthe second portion may have a second cross-sectional area that isdifferent than the first cross-sectional area. The first and secondportions may be formed (manufactured, stamped, etched, etc.) from asingle piece of material, or may be formed from multiple distinct piecesof material, or from different materials, the two distinct piecesfixedly coupled together (e.g., soldered, sandwiched, etc.).

In some embodiments, the interface member may be one of multipleinterface members of the damper arrangement. For instance, the multipleinterface members may include a first pair of interface members and asecond pair of interface members. The second pair of interface membersmay be opposite the first pair of interface members relative to thelens. In some examples, the damper arrangement may include respectiveviscoelastic material portions disposed within respective pockets. Eachinterface member may include a respective portion that is disposedwithin a respective pocket. The arrangement of interface members may besymmetrical or asymmetrical, in embodiments.

In some cases, each interface member of the first pair of interfacemembers may include a portion that is disposed within respective volumesof the viscoelastic material (e.g., in respective pockets or the like).Similarly, each interface member of the second pair of interface membershas a portion that is disposed within respective volumes of theviscoelastic material. In some embodiments, each interface member of thefirst pair of interface members may have a first cross-sectional shape,and each interface member of the second pair of interface members mayhave a second cross-sectional shape that is different than the firstcross-sectional shape. In some examples, the first pair of interfacemembers may be arranged in a first orientation, and the second pair ofinterface members may be arranged in a second orientation that isdifferent than the first orientation. In some embodiments, the firstpair of interface members may include a first interface member that hasa first cross-sectional shape and a first orientation, and a secondinterface member that has a second cross-sectional shape and a secondorientation. The first cross-sectional shape may be different than thesecond cross-sectional shape in some embodiments. Additionally, oralternatively, the first orientation may be different than the secondorientation in some cases.

According to some examples, the damper arrangement may further include athird pair of interface members and a fourth pair of interface members.The fourth pair of interface members may be opposite the third pair ofinterface members relative to the lens.

In some embodiments, the actuator may include a voice coil motor (VCM)actuator having one or more magnets and one or more coils. Thestationary component may be a magnet holder configured to hold at leastone of the one or more magnets. Furthermore, in some cases, the lenscarrier may hold at least one of the one or more coils proximate themagnet(s) held by the magnet holder. In some examples, the pocket may bedefined by one or more surfaces of the lens carrier. An interface membermay extend from the magnet holder such that a portion of the interfacemember is disposed within the viscoelastic material in the pocket.Movement of the lens carrier during operation of the lens actuator maybe restricted (e.g., based at least in part on the interface member andthe viscoelastic material) to a range of motion. In some embodiments, atleast a minimum clearance may be maintained, across the range of motion,between the portion of the interface member that is disposed within theviscoelastic material and the one or more surfaces of the magnet holderthat define the pocket.

According to some embodiments, an actuator assembly may be configured tomove the lens carrier, relative to a stationary component such as theimage sensor, in one or more directions orthogonal to the optical axis.In embodiments, an actuator assembly is configured to move the imagesensor, relative to the lens carrier, in one or more directionsorthogonal to the optical axis (either or both of the image sensor andthe lens carrier may move dynamically with respect to other stationarycomponents of the device, such as a magnet holder or case, for example).Furthermore, in some embodiments, an actuator assembly may be configuredto tilt the lens carrier and/or the image sensor relative to the opticalaxis.

In some embodiments, a system includes a lens assembly and an actuatorassembly. The lens assembly may include one or more lens elements thatdefine an optical axis. The system may include an actuator assembly thatincludes components of a VCM fixedly coupled to a stationary componentand a dynamic component, viscoelastic material, and an interface memberthat engages the viscoelastic material. The dynamic component may beconfigured to hold the lens and move along the optical axis. Theviscoelastic material may be disposed within a pocket defined by one ormore surfaces of the stationary component or the dynamic component. Theinterface member may include a first portion and a second end portion.The first end portion may extend from the stationary component or thedynamic component. The second end portion may be disposed within theviscoelastic material. In some examples, the interface member may be arigid member such that the interface member does not bend or flex as theactuator moves during normal device operation.

In various embodiments, movement of the dynamic component duringoperation of the actuator may be restricted (e.g., based at least inpart on the interface member and the viscoelastic material) to a rangeof motion. In some instances, at least a minimum clearance may bemaintained, across the range of motion, between the second end portionof the interface member that is disposed within the viscoelasticmaterial and the surface(s) that define the pocket. In some embodiments,a spring/suspension mechanism (such as illustrated in FIG. 2 ) may beconfigured to restrict motion to maintain the minimum clearance duringnormal operation. In some implementations, the system may include one ormore processors configured to cause the actuator assembly to move thedynamic component along the optical axis. The second end portion may beconfigured to traverse within the viscoelastic material to dampen motionof the dynamic component during operation of the actuator to move thelens along the optical axis. In some embodiments, during normal deviceoperation the one or more processors control actuator movement tomaintain the minimum clearance between the second end portion of theinterface member that is disposed within the viscoelastic material andthe surface(s) that define the pocket.

In some examples, the interface member may include an intermediateportion extending between the first end portion and the second endportion. The intermediate portion may include a bend such that the firstend portion extends in a first direction, and the second end portionextends in a second direction that is different than the firstdirection. For instance, the first direction may be orthogonal to thesecond direction.

In embodiments, the interface may be formed from two distinctcomponents, such as a mounting portion (e.g., a plate or spring or thelike) and a viscoelastic engagement potion (e.g., a pin or wire, or thelike). The interface may be formed by fixedly coupling (e.g., soldering,gluing, sandwiching, etc.) the mounting portion with the viscoelasticengagement potion

In some embodiments, a method of constructing a damper arrangement of anactuator may include forming a dynamic component and/or a stationarycomponent that defines a pocket. The method may include forming aninterface between the dynamic component and the stationary component. Invarious embodiments, the interface may include a viscoelastic materialand an interface member that is at least partially within theviscoelastic material.

In some examples, to form the interface between the dynamic componentand the stationary component, the method may include placing theinterface member at least partially within the pocket. The method mayalso include placing the viscoelastic material at least partially withinthe pocket. For instance, the viscoelastic material may be placed withinthe pocket such that the interface member is at least partially withinthe viscoelastic material. Furthermore, the method may include curingthe viscoelastic material in some instances.

In other examples, to form the interface between the dynamic componentand the stationary component, the method may include placing theviscoelastic material at least partially within the pocket. The methodmay also include placing the interface member at least partially withinthe viscoelastic material. Furthermore, the method may include curingthe viscoelastic material in some instances.

Reference will now be made in detail to embodiments, examples of whichare illustrated in the accompanying drawings. In the following detaileddescription, numerous specific details are set forth in order to providea thorough understanding of the present disclosure. However, it will beapparent to one of ordinary skill in the art that some embodiments maybe practiced without these specific details. In other instances,well-known methods, procedures, components, circuits, and networks havenot been described in detail so as not to unnecessarily obscure aspectsof the embodiments.

It will also be understood that, although the terms first, second, etc.may be used herein to describe various elements, these elements shouldnot be limited by these terms. These terms are only used to distinguishone element from another. For example, a first contact could be termed asecond contact, and, similarly, a second contact could be termed a firstcontact, without departing from the intended scope. The first contactand the second contact are both contacts, but they are not the samecontact.

The terminology used in the description herein is for the purpose ofdescribing particular embodiments only and is not intended to belimiting. As used in the description and the appended claims, thesingular forms “a”, “an” and “the” are intended to include the pluralforms as well, unless the context clearly indicates otherwise. It willalso be understood that the term “and/or” as used herein refers to andencompasses any and all possible combinations of one or more of theassociated listed items. It will be further understood that the terms“includes,” “including,” “comprises,” and/or “comprising,” when used inthis specification, specify the presence of stated features, integers,steps, operations, elements, and/or components, but do not preclude thepresence or addition of one or more other features, integers, steps,operations, elements, components, and/or groups thereof.

As used herein, the term “if” may be construed to mean “when” or “upon”or “in response to determining” or “in response to detecting,” dependingon the context. Similarly, the phrase “if it is determined” or “if [astated condition or event] is detected” may be construed to mean “upondetermining” or “in response to determining” or “upon detecting [thestated condition or event]” or “in response to detecting [the statedcondition or event],” depending on the context.

FIGS. 1A and 1B each illustrate a respective cross-sectional view of anexample camera module 100 that includes an actuator assembly with adamper arrangement, in accordance with some embodiments. FIG. 1Aindicates piston motion P of one or more dynamic components of thecamera module 100. FIG. 1B indicates rocking motion R of one or moredynamic components of the camera module 100. In some embodiments, thecamera module 100 may include one or multiple features, components,and/or functionality of embodiments described herein with reference toFIGS. 2-10 .

In some examples, piston vibration of the dynamic component is inducedby external disturbances to the camera module 100, e.g., as shown inFIG. 1A. Additionally, or alternatively, external disturbances to thecamera module 100 may induce rocking vibrations of the dynamiccomponent, e.g., as shown in FIG. 1B. In various embodiments, the pistonvibrations and/or the rocking vibrations may occur during operation ofthe actuator assembly to move the dynamic component along an opticalaxis.

In the illustrated embodiment, the camera module 100 includes a lens102, an image sensor 104, and a damping arrangement that includes aninterface member 118 attached to a stationary component 110 (e.g., amagnet holder), and viscoelastic material 114 arranged within dynamiccomponent 108 (e.g., a lens carrier). The lens 102 may include one ormore lens elements that define an optical axis 106 and the lens may bepart of a lens assembly that includes the lens 102 and the dynamiccomponent 108 (e.g., a lens carrier). In some cases, one or morecomponents of the actuator assembly may be coupled to each of a dynamiccomponent 108 (e.g., the lens carrier described below with reference toFIG. 2 ) and a stationary component 110 (e.g., the magnet holderdescribed below with reference to FIG. 2 ). The dynamic component 108may hold the lens 102 such that the lens 102 moves together with thedynamic component 108. In some instances, the stationary component 110may be stationary relative to the dynamic component 108. For instance,the stationary component 110 may be attached to a fixed member, such asa case 112 that at least partially encompasses the camera module 100. Anactuator assembly (not illustrated in FIG. 1A) may be configured to movethe dynamic component 108 relative to the stationary component 110and/or the image sensor 104. For example, an actuator assembly (e.g.,like the one depicted in FIG. 2 ) may move the dynamic component 108(e.g., including the lens 102) along the optical axis 106 and/or indirections orthogonal to the optical axis 106. In embodiments, theactuator may be configured to tilt the dynamic component 108 (e.g., thelens 102, or a lens assembly) relative to the optical axis 106. In someembodiments, the stationary component 110 may be stationary relative todynamic component 108 for one or more degrees of freedom, but may alsobe moveable with dynamic component 108 in one or more other degrees offreedom with respect to another portion of camera module 100 (e.g., thedynamic component, but not the stationary component, is moveable alongthe optical axis for autofocus, while the stationary component, thedynamic component and lens move together orthogonal to the optical axisfor optical image stabilization).

In some embodiments, the damper arrangement may include a viscoelasticmaterial 114 (e.g., gel, grease, etc.) at an interface between thedynamic component 108 and the stationary component 110. For instance,the viscoelastic material 114 may be at least partially disposed withina pocket 116 defined by the dynamic component 108 and/or the stationarycomponent 110. FIGS. 1A and 1B show a pocket 116 defined by the dynamiccomponent 108. It should be understood, however, that the stationarycomponent 110 may additionally, or alternatively, define a pocket 116,e.g., as described below with reference to FIGS. 4 and 5 .

According to various examples, the damper arrangement may include aninterface member 118 that extends from the stationary component 110and/or the dynamic component 108 to at least partially into theviscoelastic material 114. For instance, FIGS. 1A and 1B show a mountingelement of the interface member 118 extending from the stationarycomponent 110 such that a viscoelastic engagement element portion of theinterface member 118 is embedded in the viscoelastic material 114 withinthe pocket 116. It should be understood, however, that the interfacemember 118 may additionally, or alternatively, extend from the dynamiccomponent 108, e.g., as described below with reference to FIGS. 4 and 5.

In various embodiments, the interface member 118 may be configured totraverse within the viscoelastic material 114 to dampen motion of thedynamic component 108, e.g., during operation of an actuator to move thedynamic component 108 along the optical axis 106, or during othermotions such as unwanted vibrations (e.g., caused by jostling ordropping the device). In some examples, movement of the dynamiccomponent 108 during operation of the actuator may be restricted (e.g.,based at least in part on the interface member 118 and the viscoelasticmaterial 114) to a range of motion. As such, at least a minimumclearance may be maintained, across the range of motion, between theportion of the interface member 118 that is disposed within theviscoelastic material 114 and the surface(s) that define the pocket 116.In some embodiments, the damper structure may dampen and/or cancelpiston vibrations, e.g., the piston vibrations indicated in FIG. 1A.Additionally, or alternatively, the damper structure may dampen and/orcancel rocking vibrations, e.g., the rocking vibrations indicated inFIG. 1B.

In some embodiments, the camera module 100 may further include asubstrate 120. The substrate 120 may support the image sensor 104 insome examples. For instance, the image sensor 104 may be attached to thesubstrate 120. Furthermore, the substrate 120 may be attached to abottom end of the case 112 in some embodiments.

FIG. 2 illustrates a cross-sectional side view of an example cameramodule 200 that includes an actuator assembly with a damper arrangement,in accordance with some embodiments. In some embodiments, the cameramodule 200 may include one or multiple features, components, and/orfunctionality of embodiments described herein with reference to FIGS.1A-B, 3A-D, 4-5, 6A-I, and 7-10.

According to various embodiments, the camera module 200 may include alens assembly 202, an image sensor 204, and one or more voice coil motor(VCM) actuator assemblies. A lens assembly 202 may include one or morelens elements that define an optical axis 206. In some cases, the VCMactuator may include a dynamic component (e.g., lens carrier 208), anintermediate component (e.g., magnet holder 210), and a damperarrangement (e.g., interface member 218 and viscoelastic material 216).In some embodiments, the lens carrier 208 may be configured to hold thelens assembly 102 (sometime referred to herein as lens 202) such thatthe lens assembly 202 moves together with the lens carrier 208.Furthermore, the lens carrier 208 may be configured with or to hold oneor more coils of the VCM actuator. For instance, one or more autofocuscoils 212 of the VCM actuator may be coupled to the lens carrier 208. Insome embodiments, the magnet holder 210 may be configured with or tohold one or more magnets of the VCM actuator. In some examples, eachautofocus coil 212 may be located proximate a respective magnet 214. Insome embodiments, multiple coils may be located proximate a same, singlemagnet. The camera module 200 may be configured to provide current tothe autofocus coil(s) 212, which may cause the autofocus coil(s) 212 tomagnetically interact with the magnet(s) 214, e.g., to produce Lorentzforces that cause the lens carrier 208 to move along the optical axis206 to provide autofocus functionality.

In various examples, the damper arrangement may include a viscoelasticmaterial 216 and an interface member 218. The viscoelastic material 216may be at least partially disposed within a pocket 220 that is definedby the lens carrier 208 and/or the magnet holder 210. FIG. 2 shows thepocket 220 defined by top surfaces of the lens carrier 208. However, thepocket 220 may be defined by other surfaces (e.g., one or more sidesurfaces, one or more bottom surfaces, etc.) of the lens carrier 208and/or one or more surfaces of the magnet holder 210 in someembodiments. The interface member 218 may extend from the magnet holder210 and/or the lens carrier 208 to at least partially into theviscoelastic material 216. For instance, FIG. 2 shows the interfacemember 218 extending from the magnet holder 210 such that an end portionis embedded within the viscoelastic material 216 in the pocket 220. Insome embodiments, the interface member 218 may be part of the magnetholder 210. In other embodiments, the interface member 218 may be aseparate component that is attached to the magnet holder 210 or someother stationary component. According to various examples, the interfacemember 218 may be configured to traverse within the viscoelasticmaterial 216 to dampen motion of the lens carrier 208 during operationof the VCM actuator to move the lens carrier 208 along the optical axis206.

In some cases, the lens carrier 208 may be at least partially supportedvia one or more spring flexures. For example, the lens carrier 208 maybe at least partially suspended via an autofocus upper spring flexure222 and/or an autofocus lower spring flexure 224. The autofocus upperspring flexure 222 and/or the autofocus lower spring flexure 224 mayalso be connected to the magnet holder 210 in some embodiments.Furthermore, the autofocus upper spring flexure 222 and/or the autofocuslower spring flexure 224 may be flexible to allow the lens carrier 208 arange of motion, e.g., along the optical axis 206.

In some embodiments, the VCM actuator may include one or more opticalimage stabilization (OIS) coils 226 on a base 228 and/or a substrate230. Each of the OIS coils 226 may be disposed proximate a respectivemagnet 214 in some embodiments. The camera module 200 may be configuredto provide current to the OIS coils 226, which may cause the OIS coils226 to magnetically interact with the magnets 214, e.g., to produceLorentz forces that cause the lens carrier 208 to move in directionsorthogonal to the optical axis 206 to provide OIS functionality. Thebase 228 and/or the substrate 230 may support the image sensor 204,e.g., below the lens 202 such that light rays may pass through the lens202 and to the image sensor 204. In some embodiments, the camera module200 may include a shield can 232 that at least partially encompasses thecamera module 200. In some cases, the base 228 and/or the substrate 230may be connected to the shield can 232. For instance, as indicated inFIG. 2 , a top surface of the substrate 230 may be attached to a bottomsurface of the shield can 232. Furthermore, one or more OIS springflexures 234 may connect the base 228 and/or the substrate 230 to themagnet holder 210. The OIS spring flexures 234 may be flexible to allowan intermediate component such as the magnet holder 210 a range ofmotion, e.g., in directions orthogonal to the optical axis 206.

In at least some embodiments, a device may be configured with a dampingassembly to dampen motion between two distinct subassemblies. Forexample, FIG. 2 illustrates an autofocus subassembly (e.g., AF coil 212of lens carrier 208 suspended via AF upper flexure 222 and AF lowerflexure 224 that applies a force to magnet 214 of magnet holder 210) andan optical image stabilization subassembly (e.g., OIS coil 226 of base228 that applies a force to magnet 214 of magnet holder 210 to provideOIS by moving the lens assembly and autofocus subassembly together onOIS spring flexures 234 orthogonal to the optical axis of the lensassembly 202). In some embodiments (not illustrated) a damping assemblysimilar to that disclosed herein may damped motion between thesubassemblies. For example, a suspended intermediate component (e.g.,the magnet holder) that itself moves with respect to the fixedcomponents of a device may include either one of a pocket with aviscoelastic material or an interface member that interacts with theviscoelastic material to dampen movement between the intermediatecomponent and a dynamic component such as the lens carrier. In theexample, a component of the dynamic component, such as the lens carrier,include the other of the pocket with the viscoelastic material or theinterface member that interacts with the viscoelastic material. In somesuch embodiments, movement between two dynamic components (e.g., the OISsubassembly being one dynamic component and the AF subassembly being theother dynamic component) may be damped by a damping assembly disclosedherein.

In some embodiments, a first component includes a fixed component suchas a a fixed portion of an AF coil (e.g., a fixed magnet and fixedmagnet holder, not illustrated in FIG. 2 ). In some such embodiments, asecond component includes a dynamic component (e.g., a lens carrier)that moves with the lens assembly with respect to the fixed component.Such a device may be arranged with one or more damping assemblies (e.g.,an interface member that interacts with viscoelastic material in apocket) to dampen movement of the second component with respect to thefirst component. In some such embodiments, the second component mayinclude an intermediate dynamic component (e.g., a suspended magnetholder) movement of which may be dampened by a damper arrangementsimilar to those disclosed herein.

In some embodiments, a first component includes a dynamic intermediatecomponent (e.g., magnet holder 210, illustrated in FIG. 2 ) that issuspended (e.g., via flexure 234) from a fixed component (e.g., base228) such that the intermediate component is movable via an actuator(e.g., OIS coil 226 and magnet 214). In some such embodiments, a secondcomponent includes another dynamic component (e.g., a lens carrier) thatmoves with the lens assembly with respect to the first component (thedynamic intermedia component such as the magnet holder 210 in FIG. 2 ).Such a device may be arranged with one or more damping assemblies (e.g.,an interface member that interacts with viscoelastic material in apocket) to dampen movement of the second component with respect to thefirst component. For instance, the intermediate component may includeeither one of a pocket with a viscoelastic material or an interfacemember that interacts with the viscoelastic material to dampen movementbetween the intermediate component and the other dynamic component suchas the lens carrier. In the example, the other dynamic component (e.g.,the lens carrier) may include the other of the pocket with theviscoelastic material or the interface member that interacts with theviscoelastic material.

FIGS. 3A-3C each illustrate a respective view of another example cameramodule 300 that includes an actuator with a damper arrangement, inaccordance with some embodiments. FIG. 3A shows an exploded perspectiveview of some components of the camera module 300. FIG. 3B shows aperspective view of an exterior of the camera module 300. FIG. 3C showsa cross-sectional top view of the camera module 300. In someembodiments, the camera module 300 may include one or multiple features,components, and/or functionality of embodiments described herein withreference to FIGS. 1A-2 and 4-10 .

In various examples, the camera module 300 may include a lens 302, ashield can 304, a lens carrier 306, a magnet holder 308, and/or a damperarrangement. Furthermore, the camera module 300 may include an actuatorconfigured to move the lens along an optical axis. For instance, theactuator may be a voice coil motor (VCM) actuator that includes one ormore autofocus coils 310 and one or more magnets 312 that magneticallyinteract with each other to produce forces that cause the lens carrier306 to move along the optical axis. The lens carrier 306 may hold thelens 302 such that the lens moves together with the lens carrier 306. Insome examples, the lens carrier 306 may hold the autofocus coils 310,and the magnet holder 308 may hold the magnets 312.

According to various embodiments, the damper arrangement may include aninterface member 314 and one or more pockets 316 comprising aviscoelastic material. The damper arrangement may provide an interfacebetween the lens carrier 306 and the magnet holder 308. In variousembodiments, the interface member 314 may be configured to traversewithin the viscoelastic material to dampen motion of the lens carrier306, e.g., during operation of the actuator to move the lens carrier 306along the optical axis. In some examples, movement of the lens carrier306 during operation of the actuator may be restricted (e.g., based atleast in part on the interface member 314 and the viscoelastic material)to a range of motion. As such, at least a minimum clearance may bemaintained, across the range of motion, between the portion of theinterface member 314 that is disposed within the viscoelastic materialand the surface(s) that define the pocket 316.

According to some examples, the camera module 300 may have a damperarrangement that includes multiple interface members 314 and pockets 316comprising viscoelastic material, e.g., as shown in FIG. 3C. In someembodiments, the damper arrangement may include a first pair ofinterface members 314 a and a second pair of interface members 314 b.The second pair of interface members 314 b may be opposite the firstpair of interface members 314 a relative to the lens 302. The damperarrangement may include respective viscoelastic material portionsdisposed within respective pockets, and each interface member mayinclude a respective portion that is disposed within a respectivepocket.

In some cases, each interface member of the first pair of interfacemembers 314 a may include a portion that is disposed within a respectivepocket/viscoelastic material 316. Similarly, each interface member ofthe second pair of interface members 314 b has a portion that isdisposed within a respective pocket/viscoelastic material 316. In someembodiments, each interface member of the first pair of interfacemembers 314 a may have a first cross-sectional shape, and each interfacemember of the second pair of interface members 314 b may have a secondcross-sectional shape that is different than the first cross-sectionalshape. In some examples, the first pair of interface members 314 a maybe arranged in a first orientation, and the second pair of interfacemembers 314 b may be arranged in a second orientation that is differentthan the first orientation. In some embodiments, the first pair ofinterface members 314 a may include a first interface member that has afirst cross-sectional shape and a first orientation, and a secondinterface member that has a second cross-sectional shape and a secondorientation. The first cross-sectional shape may be different than thesecond cross-sectional shape in some embodiments. Additionally, oralternatively, the first orientation may be different than the secondorientation in some cases.

According to some examples, the damper arrangement may further include athird pair of interface members 314 c and a fourth pair of interfacemembers 314 d. The fourth pair of interface members 314 d may beopposite the third pair of interface members 314 c relative to the lens302. While FIG. 3C shows the interface members and pockets on the topside of the structure relative to the image sensor, in other embodimentsthe interface members and pockets may be on the underneath side relativeto the image sensor (side closer to the image sensor) or a combinationof interface members and pockets may be present on both the top side andunderneath side.

FIG. 3D illustrates two-piece interface elements 314 a/b. In at leastthe illustrated embodiment, the heads of wires 315 a/b are illustratedas soldered to plates of the interface elements 314 a/b.

FIG. 4 illustrates a cross-sectional view of an example damperarrangement 400, in accordance with some embodiments. In someembodiments, the damper arrangement 400 may include one or multiplefeatures, components, and/or functionality of embodiments describedherein with reference to FIGS. 1A-3C and 5-10 .

According to some embodiments, the damper arrangement 400 may include afirst set of one or more interface members 402 that are part of astationary component 404, and a second set of one or more interfacemembers 406 that are part of a dynamic component 408. The damperarrangement 400 may further include a viscoelastic material 410 disposedat least partially within one or more pockets. For instance, thestationary component 404 may define a first pocket 412 within which atleast a portion of the viscoelastic material 410 may be located.Similarly, the dynamic component 408 may define a second pocket 414within which at least a portion of the viscoelastic material 410 may belocated. The viscoelastic material 410 may be sandwiched between and/orheld by the stationary component 404 and the dynamic component 408 atleast partially via the first pocket 412 and the second pocket 414.

In some examples, the stationary component 404, the dynamic component408, and/or the damper arrangement 400 may be part of an actuator. Forinstance, the actuator may be a lens actuator. The dynamic component 408may configured to hold a lens 416 such that the lens 416 moves togetherwith the dynamic component 408. The lens actuator may be configured tomove the dynamic component 408 (and thus the lens 416) along an opticalaxis of the lens 416. The dynamic component 408 may be configured tomove relative to the stationary component 404 in some instances.

FIG. 5 illustrates a cross-sectional view of another example damperarrangement 500, in accordance with some embodiments. In someembodiments, the damper arrangement 500 may include one or multiplefeatures, components, and/or functionality of embodiments describedherein with reference to FIGS. 1A-B, 2, 3A-D, 6A-L, and 7-10, forexample.

According to some embodiments, the damper arrangement 500 may include aninterface member 502 and a viscoelastic material 504 disposed at leastpartially within a pocket 506. The interface member 502 may be part of adynamic component 508. Furthermore, the pocket 506 may be defined by astationary component 510. As indicated in FIG. 5 , a portion of theviscoelastic material 504 may protrude outside of the pocket 506 in someinstances.

In some examples, the stationary component 510, the dynamic component508, and/or the damper arrangement 500 may be part of an actuator. Forinstance, the actuator may be a lens actuator. The dynamic component 508may be configured to hold a lens 512 such that the lens 512 movestogether with the dynamic component 508. The lens actuator may beconfigured to move the dynamic component 508 (and thus the lens 512)along an optical axis of the lens 512. The dynamic component 508 may beconfigured to move relative to the stationary component 510, in someinstances.

FIGS. 6A-6L each illustrate a respective view of example damperarrangements, in accordance with some embodiments. FIG. 6A illustrates across-sectional view of an example damper arrangement 600, in accordancewith some embodiments. In some embodiments, the damper arrangement 600may include one or multiple features, components, and/or functionalityof embodiments described herein with reference to FIGS. 1A-B, 2, 3A-D,4-5, and 7-10. While FIGS. 6A-6B generally illustrate a relationship ofan interface member of a stationary component to a pocket of a dynamiccomponent, the concepts illustrated may also be applied to variousintermediate components (e.g., a magnet holder suspended by variousflexures) from which a dynamic component such as a lens carrier may besuspended (e.g., by additional flexures). For instance, an intermediatecomponent may include either of the pocket or the interface member, suchas the interface members illustrated in FIGS. 6C-6L.

According to some embodiments, the damper arrangement 600 may include aninterface member 602 and a viscoelastic material 604 disposed at leastpartially within a pocket 606. The interface member 602 may be part of astationary component 608. Furthermore, the pocket 606 may be defined bya dynamic component 610. As indicated in FIG. 6 , the viscoelasticmaterial 604 may be located completely within the pocket 606 in someinstances.

In some examples, the stationary component 608, the dynamic component610, and/or the damper arrangement 600 may be configured with one ormore components of an actuator. For instance, the actuator may be aVCM-based lens actuator. The dynamic component 610 may configured tohold a lens 612 such that the lens 612 moves together with the dynamiccomponent 610. The VCM-based lens actuator may be configured to move thedynamic component 610 (and thus the lens 612) along an optical axis ofthe lens 612. The dynamic component 610 may be configured to moverelative to the stationary component 608 (and the interface member 602)in some instances.

FIG. 6B illustrates a cross-sectional view of an example damperarrangement 600, in accordance with some embodiments. In someembodiments, the damper arrangement 600 may include one or multiplefeatures, components, and/or functionality of embodiments describedherein with reference to FIGS. 1A-B, 2, 3A-D, 4-5, and 7-10.

In at least the illustrated embodiment, a two-piece interface elementincludes plate 630 fixedly-coupled to wire 634 via solder 632. The plateis depicted with anti-vibration coating 636 (e.g., a polymer-basedanti-vibration coating). The wire 634 is depicted as traversingviscoelastic material 604 that is contained within a bottomless pocket639. The viscoelastic material 604 is depicted with upper layer or skin638.

As described for various embodiments herein, a thickness of the plate630 may be varied in various embodiments, sometimes altering theflexibility characteristics of the plate. Anti-vibration coating 636 maybe applied to the plate 630 (e.g., via). The coating may reducevibrations, in embodiments. The upper layer 638 of the viscoelasticmaterial 604 may be treated to form an upper skin with differentcharacteristics than the rest of the viscoelastic material 604. Forexample, the upper layer 638 may be exposed to various processes thatalter a flexibility or attachment characteristic (e.g., how well theviscoelastic material 604 “sticks” to the wire) of the viscoelasticmaterial 604. Such a skin may increase the reliability of the dampingarrangement, in embodiments (e.g., reducing the creation of troughs orgouges in the viscoelastic material 604 that decrease damping).

FIGS. 6C-6E illustrate top-down views of various embodiments of aninterface member with a pin soldered to a plate, according to someembodiments. In some embodiments, the interface members may function asor with one or multiple features, components, and/or functionality ofembodiments described herein with reference to FIGS. 1A-B, 2, 3A-D, 4-5,and 7-10.

In embodiments, various physical characteristics of an interface elementmay be altered to change the response of the interface element tomovement or vibration. In particular, 6C illustrates a top-down view ofan interface member 640 with an arm of the interface member having awidth w1, while FIG. 6D illustrates a top-down view of an interfacemember 642 having an arm with a width w2 and a length L1. Altering awidth or a length of the arm may cause the arm to be more or lessflexible. For example, FIG. 6D illustrates a top-down view of aninterface member 642 with an arm of the interface member having a widthw2 and length L1, while FIG. 6E illustrates a top-down view of aninterface member 644 having an arm with a length L2 that is longer thanL1, thereby causing the interface element 644 arm to be more flexiblethan the interface element 642 arm.

FIGS. 6F-6H illustrate various configurations of a side cross-sectionview of an interface member, according to some embodiments. In someembodiments, the interface members may function as or with one ormultiple features, components, and/or functionality of embodimentsdescribed herein with reference to FIGS. 1A-B, 2, 3A-D, 4-5, and 7-10.By varying the physical shape and/or materials of the interface element,the responsive characteristics of the interface element may be altered.

FIG. 6F illustrates that the interface element 646 may be a machinedone-piece structure with an upper mounting section thickness X and alower viscoelastic material interface section with a thickness orcross-section of Y, less than thickness X.

FIG. 6G illustrates that the interface element 647 may be a formedone-piece structure with an upper mounting section thickness X and alower viscoelastic material interface section with a thickness orcross-section of Y, less than thickness X.

FIG. 6H illustrates that the interface element 648 may be a formed froma two-piece structure (e.g., a plate or spring) with an upper mountingsection thickness X and a lower viscoelastic material interface section649 (e.g., a pin or wore) with a thickness or cross-section of Y, lessthan thickness X.

FIGS. 6I-6L illustrate various configurations of an interface memberinteracting with viscoelastic material, according to some embodiments.In some embodiments, the interface members may function as or with oneor multiple features, components, and/or functionality of embodimentsdescribed herein with reference to FIGS. 1A-B, 2, 3A-D, 4-5, and 7-10.

FIG. 6I, for example, illustrates the system in a steady state where thepin 634 that is soldered 633 to plate 630 is resting without movement inviscoelastic material 604 disposed at least partially within a pocket(not illustrated). FIG. 6J illustrates that the plate 630 and/or pin 634may be created of materials or may be manufactured such that either theplate or the pin exhibits some amount of flexibility, in contrast tobeing rigid. For example, the plate is depicted as flexing through arc mand the pin is depicted as flexing through arc n as the mounting pointfor the interface element moves.

FIG. 6K illustrates an alternative structure for the interface elementwhere instead of being soldered in a hole (e.g., as in FIGS. 6I and 6J)the pin or wire 634 is soldered on the end of the plate 630.

FIG. 6L illustrates that as the interface element move upward, theviscoelastic material 604 may deform as it stays attached to the pin(instead of detaching or forming a trough within the viscoelasticmaterial 604 that reduces the reliability of the damping arrangement.

FIG. 7 is a flowchart of an example method 700 of constructing a damperarrangement, in accordance with some embodiments. In some embodiments,the method 700 may include one or multiple features, components, and/orfunctionality of embodiments described herein with reference to FIGS.1-6A-L and 8-10.

At 702 a, the method 700 may include forming a dynamic component thatdefines a pocket. Additionally, or alternatively, the method 700 mayinclude forming a stationary component that defines a pocket, at 702 b.

At 704, the method 700 may include forming an interface between thedynamic component and the stationary component. In various embodiments,the interface may include a viscoelastic material and an interfacemember that is at least partially within the viscoelastic material.

In some embodiments, the plate may be coated with a polymer-basedcoating, via painting, spraying, bonding, etc.,

At least FIGS. 3D, 6B-6E, and 6H-6L illustrate a two-piece interfacemember. A two-piece interface member may be formed in any of variousways. For example, a two-piece interface member may be formed by forminga hole in a plate 630, locating a pin or wire in the hole, a solderingthe pin or wire in place in the hole in the plate 630. Othermanufacturing methods are contemplated. For example, in someembodiments, a pin or wire may be soldered to the end of the plate,eliminating the need to form a hole in the plate.

In some embodiments, to form the interface between the dynamic componentand the stationary component, the method 700 may include placing theinterface member at least partially within the pocket, at 706 a. In someinstances, the interface member may be made of a metal. Furthermore, theinterface member may be a rigid member and may be formed via an etchingprocess and/or a stamping process. At 708 a, the method 700 may includeplacing the viscoelastic material at least partially within the pocket.For instance, the viscoelastic material may be placed within the pocketsuch that the interface member is at least partially within theviscoelastic material. Furthermore, at 710, the method 700 may includecuring the viscoelastic material in some instances.

In embodiments, various forms of curing may be applied to variousdifferent portions of the viscoelastic material. For instance, broadspectrum curing may be performed on one portion of the viscoelasticmaterial while narrow spectrum curing may be applied to another portionof the viscoelastic material.

In other examples, to form the interface between the dynamic componentand the stationary component, the method 700 may include placing theviscoelastic material at least partially within the pocket, at 706 b. At708 b, the method 700 may include placing the interface member at leastpartially within the viscoelastic material. Furthermore, at 710, themethod 700 may include curing the viscoelastic material in someinstances.

Multifunction Device Examples

FIG. 8 illustrates a block diagram of a portable multifunction device800, in accordance with some embodiments. In some embodiments, theportable multifunction device 800 may include one or multiple features,components, and/or implement functionality of embodiments describedherein with reference to FIGS. 1-7, 9, and 10 .

In some embodiments, the device 800 is a portable communications device,such as a mobile telephone, that also contains other functions, such asPDA, camera, video capture and/or playback, and/or music playerfunctions. Example embodiments of portable multifunction devicesinclude, without limitation, the iPhone®, iPod Touch®, and iPad® devicesfrom Apple Inc. of Cupertino, Calif. Other portable electronic devices,such as laptops, cell phones, smartphones, pad or tablet computers withtouch-sensitive surfaces (e.g., touch screen displays and/or touchpads), may also be used. It should also be understood that, in someembodiments, the device is not a portable communications device, but isa desktop computer with a touch-sensitive surface (e.g., a touch screendisplay and/or a touch pad). In some embodiments, the device is a gamingcomputer with orientation sensors (e.g., orientation sensors in a gamingcontroller). In other embodiments, the device is not a portablecommunications device, but is a camera and/or video camera.

In the discussion that follows, an electronic device that includes adisplay and a touch-sensitive surface is described. It should beunderstood, however, that the electronic device may include one or moreother physical user-interface devices, such as a physical keyboard, amouse and/or a joystick.

The device 800 typically supports a variety of applications, such as oneor more of the following: a drawing application, a presentationapplication, a word processing application, a website creationapplication, a disk authoring application, a spreadsheet application, agaming application, a telephone application, a video conferencingapplication, an e-mail application, an instant messaging application, aworkout support application, a photo management application, a digitalcamera application, a digital video camera application, a web browsingapplication, a digital music player application, a streaming videoapplication, and/or a digital video player application.

The various applications that may be executed on the device 800 may useat least one common physical user-interface device, such as thetouch-sensitive surface. One or more functions of the touch-sensitivesurface as well as corresponding information displayed on the device maybe adjusted and/or varied from one application to the next and/or withina respective application. In this way, a common physical architecture(such as the touch-sensitive surface) of the device may support thevariety of applications with user interfaces that are intuitive andtransparent to the user.

Device 800 may include memory 802 (which may include one or morecomputer readable storage mediums), memory controller 822, one or moreprocessing units (CPU's) 820, peripherals interface 818, RF circuitry808, audio circuitry 810, speaker 811, touch-sensitive display system812, microphone 813, input/output (I/O) subsystem 806, other inputcontrol devices 816, and external port 824. Device 800 may include oneor more optical sensors or cameras 864 (e.g., one or more embodiments ofthe cameras described herein). These components may communicate over oneor more communication buses or signal lines 803.

It should be appreciated that device 800 is only one example of aportable multifunction device, and that device 800 may have more orfewer components than shown, may combine two or more components, or mayhave a different configuration or arrangement of the components. Thevarious components shown in FIG. 8 may be implemented in hardware,software, or a combination of hardware and software, including one ormore signal processing and/or application specific integrated circuits.

Memory 802 may include high-speed random-access memory and may alsoinclude non-volatile memory, such as one or more magnetic disk storagedevices, flash memory devices, or other non-volatile solid-state memorydevices. Access to memory 802 by other components of device 800, such asCPU 820 and the peripherals interface 818, may be controlled by memorycontroller 822.

Peripherals interface 818 can be used to couple input and outputperipherals of the device to CPU 820 and memory 802. The one or moreprocessors 820 run or execute various software programs and/or sets ofinstructions stored in memory 802 to perform various functions fordevice 800 and to process data.

In some embodiments, peripherals interface 818, CPU 820, and memorycontroller 822 may be implemented on a single chip, such as chip 804. Insome other embodiments, they may be implemented on separate chips.

RF (radio frequency) circuitry 808 receives and sends RF signals, alsocalled electromagnetic signals. RF circuitry 808 converts electricalsignals to/from electromagnetic signals and communicates withcommunications networks and other communications devices via theelectromagnetic signals. RF circuitry 808 may include well-knowncircuitry for performing these functions, including but not limited toan antenna system, an RF transceiver, one or more amplifiers, a tuner,one or more oscillators, a digital signal processor, a coder/decoder(codec) chipset, a subscriber identity module (SIM) card, memory, and soforth. RF circuitry 808 may communicate with networks, such as theInternet, also referred to as the World Wide Web (WWW), an intranetand/or a wireless network, such as a cellular telephone network, awireless local area network (LAN) and/or a metropolitan area network(MAN), and other devices by wireless communication. The wirelesscommunication may use any of a variety of communications standards,protocols and technologies, including but not limited to Global Systemfor Mobile Communications (GSM), Enhanced Data GSM Environment (EDGE),high-speed downlink packet access (HSDPA), high-speed uplink packetaccess (HSUPA), wideband code division multiple access (W-CDMA), codedivision multiple access (CDMA), time division multiple access (TDMA),Bluetooth, Wireless Fidelity (Wi-Fi) (e.g., IEEE 802.11a, IEEE 802.11b,IEEE 802.11g and/or IEEE 802.11n), voice over Internet Protocol (VoIP),Wi-MAX, a protocol for e-mail (e.g., Internet message access protocol(IMAP) and/or post office protocol (POP)), instant messaging (e.g.,extensible messaging and presence protocol (XMPP), Session InitiationProtocol for Instant Messaging and Presence Leveraging Extensions(SIMPLE), Instant Messaging and Presence Service (IMPS)), and/or ShortMessage Service (SMS), or any other suitable communication protocol,including communication protocols not yet developed as of the filingdate of this document.

Audio circuitry 810, speaker 811, and microphone 813 provide an audiointerface between a user and device 800. Audio circuitry 810 receivesaudio data from peripherals interface 818, converts the audio data to anelectrical signal, and transmits the electrical signal to speaker 811.Speaker 811 converts the electrical signal to audible sound waves. Audiocircuitry 810 also receives electrical signals converted by microphone813 from sound waves. Audio circuitry 810 converts the electrical signalto audio data and transmits the audio data to peripherals interface 818for processing. Audio data may be retrieved from and/or transmitted tomemory 802 and/or RF circuitry 808 by peripherals interface 818. In someembodiments, audio circuitry 810 also includes a headset jack. Theheadset jack provides an interface between audio circuitry 810 andremovable audio input/output peripherals, such as output-only headphonesor a headset with both output (e.g., a headphone for one or both ears)and input (e.g., a microphone).

I/O subsystem 806 couples input/output peripherals on device 800, suchas touch screen 812 and other input control devices 816, to peripheralsinterface 818. I/O subsystem 806 may include display controller 856 andone or more input controllers 860 for other input control devices 816.The one or more input controllers 860 receive/send electrical signalsfrom/to other input control devices 816. The other input control devices816 may include physical buttons (e.g., push buttons, rocker buttons,etc.), dials, slider switches, joysticks, click wheels, and so forth. Insome alternative embodiments, input controller(s) 860 may be coupled toany (or none) of the following: a keyboard, infrared port, USB port, anda pointer device such as a mouse. The one or more buttons may include anup/down button for volume control of speaker 811 and/or microphone 813.The one or more buttons may include a push button.

Touch-sensitive display 812 provides an input interface and an outputinterface between the device and a user. Display controller 856 receivesand/or sends electrical signals from/to touch screen 812. Touch screen812 displays visual output to the user. The visual output may includegraphics, text, icons, video, and any combination thereof (collectivelytermed “graphics”). In some embodiments, some or all of the visualoutput may correspond to user-interface objects.

Touch screen 812 has a touch-sensitive surface, sensor or set of sensorsthat accepts input from the user based on haptic and/or tactile contact.Touch screen 812 and display controller 856 (along with any associatedmodules and/or sets of instructions in memory 802) detect contact (andany movement or breaking of the contact) on touch screen 812 andconverts the detected contact into interaction with user-interfaceobjects (e.g., one or more soft keys, icons, web pages or images) thatare displayed on touch screen 812. In an example embodiment, a point ofcontact between touch screen 812 and the user corresponds to a finger ofthe user.

Touch screen 812 may use LCD (liquid crystal display) technology, LPD(light emitting polymer display) technology, or LED (light emittingdiode) technology, although other display technologies may be used inother embodiments. Touch screen 812 and display controller 856 maydetect contact and any movement or breaking thereof using any of avariety of touch sensing technologies now known or later developed,including but not limited to capacitive, resistive, infrared, andsurface acoustic wave technologies, as well as other proximity sensorarrays or other elements for determining one or more points of contactwith touch screen 812. In an example embodiment, projected mutualcapacitance sensing technology is used, such as that found in theiPhone®, iPod Touch®, and iPad® from Apple Inc. of Cupertino, Calif.

Touch screen 812 may have a video resolution in excess of 100 dpi. Insome embodiments, the touch screen has a video resolution ofapproximately 160 dpi. The user may contact touch screen 812 using anysuitable object or appendage, such as a stylus, a finger, and so forth.In some embodiments, the user interface is designed to work primarilywith finger-based contacts and gestures, which can be less precise thanstylus-based input due to the larger area of contact of a finger on thetouch screen. In some embodiments, the device translates the roughfinger-based input into a precise pointer/cursor position or command forperforming the actions desired by the user.

In some embodiments, in addition to the touch screen 812, device 800 mayinclude a touchpad (not shown) for activating or deactivating particularfunctions. In some embodiments, the touchpad is a touch-sensitive areaof the device that, unlike the touch screen, does not display visualoutput. The touchpad may be a touch-sensitive surface that is separatefrom touch screen 812 or an extension of the touch-sensitive surfaceformed by the touch screen.

Device 800 also includes power system 862 for powering the variouscomponents. Power system 862 may include a power management system, oneor more power sources (e.g., battery, alternating current (AC)), arecharging system, a power failure detection circuit, a power converteror inverter, a power status indicator (e.g., a light-emitting diode(LED)) and any other components associated with the generation,management and distribution of power in portable devices.

Device 800 may also include one or more optical sensors or cameras 864.FIG. 8 shows an optical sensor coupled to optical sensor controller 858in I/O subsystem 806. Optical sensor 864 may, for example, includecharge-coupled device (CCD) or complementary metal-oxide semiconductor(CMOS) phototransistors or photosensors. Optical sensor 864 receiveslight from the environment, projected through one or more lenses, andconverts the light to data representing an image. In conjunction withimaging module 843 (also called a camera module), optical sensor 864 maycapture still images and/or video sequences. In some embodiments, atleast one optical sensor may be located on the back of device 800,opposite touch screen display 812 on the front of the device. In someembodiments, the touch screen display may be used as a viewfinder forstill and/or video image acquisition. In some embodiments, at least oneoptical sensor may instead or also be located on the front of thedevice.

Device 800 may also include one or more proximity sensors 866. FIG. 8shows proximity sensor 866 coupled to peripherals interface 818.Alternatively, proximity sensor 866 may be coupled to input controller860 in I/O subsystem 806. In some embodiments, the proximity sensorturns off and disables touch screen 812 when the multifunction device isplaced near the user's ear (e.g., when the user is making a phone call).

Device 800 may also include one or more orientation sensors 868. In someembodiments, the one or more orientation sensors include one or moreaccelerometers (e.g., one or more linear accelerometers and/or one ormore rotational accelerometers). In some embodiments, the one or moreorientation sensors include one or more gyroscopes. In some embodiments,the one or more orientation sensors include one or more magnetometers.In some embodiments, the one or more orientation sensors include one ormore of global positioning system (GPS), Global Navigation SatelliteSystem (GLONASS), and/or other global navigation system receivers. TheGPS, GLONASS, and/or other global navigation system receivers may beused for obtaining information concerning the location and orientation(e.g., portrait or landscape) of device 800. In some embodiments, theone or more orientation sensors include any combination oforientation/rotation sensors. FIG. 8 shows the one or more orientationsensors 868 coupled to peripherals interface 818. Alternatively, the oneor more orientation sensors 868 may be coupled to an input controller860 in I/O subsystem 806. In some embodiments, information is displayedon the touch screen display in a portrait view or a landscape view basedon an analysis of data received from the one or more orientationsensors.

In some embodiments, device 800 may also include one or more othersensors (not shown) including but not limited to ambient light sensorsand motion detectors. These sensors may be coupled to peripheralsinterface 818 or, alternatively, may be coupled to an input controller860 in I/O subsystem 806. For example, in some embodiments, device 800may include at least one forward-facing (away from the user) and atleast one backward-facing (towards the user) light sensors that may beused to collect ambient lighting metrics from the environment of thedevice 800 for use in video and image capture, processing, and displayapplications.

In some embodiments, the software components stored in memory 802include operating system 826, communication module 828, contact/motionmodule (or set of instructions) 830, graphics module 832, text inputmodule 834, Global Positioning System (GPS) module 835, and applications836. Furthermore, in some embodiments memory 802 stores device/globalinternal state 857. Device/global internal state 857 includes one ormore of: active application state, indicating which applications, ifany, are currently active; display state, indicating what applications,views or other information occupy various regions of touch screendisplay 812; sensor state, including information obtained from thedevice's various sensors and input control devices 816; and locationinformation concerning the device's location and/or attitude.

Operating system 826 (e.g., Darwin, RTXC, LINUX, UNIX, OS X, WINDOWS, oran embedded operating system such as VxWorks) includes various softwarecomponents and/or drivers for controlling and managing general systemtasks (e.g., memory management, storage device control, powermanagement, etc.) and facilitates communication between various hardwareand software components.

Communication module 828 facilitates communication with other devicesover one or more external ports 824 and also includes various softwarecomponents for handling data received by RF circuitry 808 and/orexternal port 824. External port 824 (e.g., Universal Serial Bus (USB),FIREWIRE, etc.) is adapted for coupling directly to other devices orindirectly over a network (e.g., the Internet, wireless LAN, etc.). Insome embodiments, the external port is a multi-pin (e.g., 30-pin)connector that is the same as, or similar to and/or compatible with the30-pin connector used on iPod (trademark of Apple Inc.) devices.

Contact/motion module 830 may detect contact with touch screen 812 (inconjunction with display controller 856) and other touch sensitivedevices (e.g., a touchpad or physical click wheel). Contact/motionmodule 830 includes various software components for performing variousoperations related to detection of contact, such as determining ifcontact has occurred (e.g., detecting a finger-down event), determiningif there is movement of the contact and tracking the movement across thetouch-sensitive surface (e.g., detecting one or more finger-draggingevents), and determining if the contact has ceased (e.g., detecting afinger-up event or a break in contact). Contact/motion module 830receives contact data from the touch-sensitive surface. Determiningmovement of the point of contact, which is represented by a series ofcontact data, may include determining speed (magnitude), velocity(magnitude and direction), and/or an acceleration (a change in magnitudeand/or direction) of the point of contact. These operations may beapplied to single contacts (e.g., one finger contacts) or to multiplesimultaneous contacts (e.g., “multi-touch”/multiple finger contacts). Insome embodiments, contact/motion module 830 and display controller 856detect contact on a touchpad.

Contact/motion module 830 may detect a gesture input by a user.Different gestures on the touch-sensitive surface have different contactpatterns. Thus, a gesture may be detected by detecting a particularcontact pattern. For example, detecting a finger tap gesture includesdetecting a finger-down event followed by detecting a finger-up (liftoff) event at the same position (or substantially the same position) asthe finger-down event (e.g., at the position of an icon). As anotherexample, detecting a finger swipe gesture on the touch-sensitive surfaceincludes detecting a finger-down event followed by detecting one or morefinger-dragging events, and subsequently followed by detecting afinger-up (lift off) event.

Graphics module 832 includes various software components for renderingand displaying graphics on touch screen 812 or other display, includingcomponents for changing the intensity of graphics that are displayed. Asused herein, the term “graphics” includes any object that can bedisplayed to a user, including without limitation text, web pages, icons(such as user-interface objects including soft keys), digital images,videos, animations and the like.

In some embodiments, graphics module 832 stores data representinggraphics to be used. Each graphic may be assigned a corresponding code.Graphics module 832 receives, from applications etc., one or more codesspecifying graphics to be displayed along with, if necessary, coordinatedata and other graphic property data, and then generates screen imagedata to output to display controller 856.

Text input module 834, which may be a component of graphics module 832,provides soft keyboards for entering text in various applications thatneed text input.

GPS module 835 determines the location of the device and provides thisinformation for use in various applications (e.g., to telephone module838 for use in location-based dialing, to camera module 843 aspicture/video metadata, and to applications that provide location-basedservices such as map/navigation applications).

Applications 836 may include one or more of, but are not limited to, thefollowing modules (or sets of instructions), or a subset or supersetthereof:

-   -   telephone module 838;    -   video conferencing module 839;    -   camera module 843 for still and/or video imaging;    -   image management module 844;    -   browser module 847;    -   search module 851;    -   video and music player module 852, which may be made up of a        video player module and a music player module; and/or    -   online video module 855.    -   one or more other modules not shown, such as a gaming module.

Examples of other applications 836 that may be stored in memory 802include but are not limited to other word processing applications, otherimage editing applications, drawing applications, presentationapplications, communication/social media applications, map applications,JAVA-enabled applications, encryption, digital rights management, voicerecognition, and voice replication.

In conjunction with RF circuitry 808, audio circuitry 810, speaker 811,microphone 813, touch screen 812, display controller 856, contact module830, graphics module 832, and text input module 834, telephone module838 may be used to enter a sequence of characters corresponding to atelephone number, access one or more telephone numbers in an addressbook, modify a telephone number that has been entered, dial a respectivetelephone number, conduct a conversation and disconnect or hang up whenthe conversation is completed. As noted above, the wirelesscommunication may use any of a variety of communications standards,protocols and technologies.

In conjunction with RF circuitry 808, audio circuitry 810, speaker 811,microphone 813, touch screen 812, display controller 856, optical sensor864, optical sensor controller 858, contact/motion module 830, graphicsmodule 832, text input module 834, and telephone module 838,videoconferencing module 839 includes executable instructions toinitiate, conduct, and terminate a video conference between a user andone or more other participants in accordance with user instructions.

In conjunction with touch screen 812, display controller 856, opticalsensor(s) 864, optical sensor controller 858, contact/motion module 830,graphics module 832, and image management module 844, camera module 843includes executable instructions to capture still images or video(including a video stream) and store them into memory 802, modifycharacteristics of a still image or video, or delete a still image orvideo from memory 802.

In conjunction with touch screen 812, display controller 856,contact/motion module 830, graphics module 832, text input module 834,and camera module 843, image management module 844 includes executableinstructions to arrange, modify (e.g., edit), or otherwise manipulate,label, delete, present (e.g., in a digital slide show or album), andstore still and/or video images.

In conjunction with RF circuitry 808, touch screen 812, display systemcontroller 856, contact/motion module 830, graphics module 832, and textinput module 834, browser module 847 includes executable instructions tobrowse the Internet in accordance with user instructions, includingsearching, linking to, receiving, and displaying web pages or portionsthereof, as well as attachments and other files linked to web pages.

In conjunction with touch screen 812, display system controller 856,contact/motion module 830, graphics module 832, and text input module834, search module 851 includes executable instructions to search fortext, music, sound, image, video, and/or other files in memory 802 thatmatch one or more search criteria (e.g., one or more user-specifiedsearch terms) in accordance with user instructions.

In conjunction with touch screen 812, display system controller 856,contact/motion module 830, graphics module 832, audio circuitry 810,speaker 811, RF circuitry 808, and browser module 847, video and musicplayer module 852 includes executable instructions that allow the userto download and play back recorded music and other sound files stored inone or more file formats, such as MP3 or AAC files, and executableinstructions to display, present or otherwise play back videos (e.g., ontouch screen 812 or on an external, connected display via external port824). In some embodiments, device 800 may include the functionality ofan MP3 player, such as an iPod (trademark of Apple Inc.).

In conjunction with touch screen 812, display system controller 856,contact/motion module 830, graphics module 832, audio circuitry 810,speaker 811, RF circuitry 808, text input module 834, and browser module847, online video module 855 includes instructions that allow the userto access, browse, receive (e.g., by streaming and/or download), playback (e.g., on the touch screen or on an external, connected display viaexternal port 824), and otherwise manage online videos in one or morevideo formats, such as the H.264/AVC format or the H.265/HEVC format.

Each of the above identified modules and applications correspond to aset of executable instructions for performing one or more functionsdescribed above and the methods described in this application (e.g., thecomputer-implemented methods and other information processing methodsdescribed herein). These modules (i.e., sets of instructions) need notbe implemented as separate software programs, procedures or modules, andthus various subsets of these modules may be combined or otherwiserearranged in various embodiments. In some embodiments, memory 802 maystore a subset of the modules and data structures identified above.Furthermore, memory 802 may store additional modules and data structuresnot described above.

In some embodiments, device 800 is a device where operation of apredefined set of functions on the device is performed exclusivelythrough a touch screen and/or a touchpad. By using a touch screen and/ora touchpad as the primary input control device for operation of device800, the number of physical input control devices (such as push buttons,dials, and the like) on device 800 may be reduced.

The predefined set of functions that may be performed exclusivelythrough a touch screen and/or a touchpad include navigation between userinterfaces. In some embodiments, the touchpad, when touched by the user,navigates device 800 to a main, home, or root menu from any userinterface that may be displayed on device 800. In such embodiments, thetouchpad may be referred to as a “menu button.” In some otherembodiments, the menu button may be a physical push button or otherphysical input control device instead of a touchpad.

FIG. 9 depicts illustrates an example portable multifunction device 800that may include one or more cameras, in accordance with someembodiments. In some embodiments, the portable multifunction device 800may include one or multiple features, components, and/or functionalityof embodiments described herein with reference to FIGS. 1-8 and 10 .

The device 800 may have a touch screen 812. The touch screen 812 maydisplay one or more graphics within user interface (UI) 900. In thisembodiment, as well as others described below, a user may select one ormore of the graphics by making a gesture on the graphics, for example,with one or more fingers 902 (not drawn to scale in the figure) or oneor more styluses 903 (not drawn to scale in the figure).

Device 800 may also include one or more physical buttons, such as “home”or menu button 904. As described previously, menu button 904 may be usedto navigate to any application 836 in a set of applications that may beexecuted on device 800. Alternatively, in some embodiments, the menubutton 904 is implemented as a soft key in a GUI displayed on touchscreen 812.

In one embodiment, device 800 includes touch screen 812, menu button904, push button 906 for powering the device on/off and locking thedevice, volume adjustment button(s) 908, Subscriber Identity Module(SIM) card slot 910, head set jack 912, and docking/charging externalport 824. Push button 906 may be used to turn the power on/off on thedevice by depressing the button and holding the button in the depressedstate for a predefined time interval; to lock the device by depressingthe button and releasing the button before the predefined time intervalhas elapsed; and/or to unlock the device or initiate an unlock process.In an alternative embodiment, device 800 also may accept verbal inputfor activation or deactivation of some functions through microphone 813.

It should be noted that, although many of the examples herein are givenwith reference to optical sensor(s)/camera(s) 864 (on the front of adevice), one or more rear-facing cameras or optical sensors that arepointed opposite from the display may be used instead of, or in additionto, an optical sensor(s)/camera(s) 864 on the front of a device.

Example Computer System

FIG. 10 illustrates an example computer system 1000 that may include oneor more cameras, in accordance with some embodiments. In someembodiments, the computer system 1000 may include one or multiplefeatures, components, and/or implement functionality of embodimentsdescribed herein with reference to FIGS. 1-9 .

The computer system 1000 may be configured to execute any or all of theembodiments described above. In different embodiments, computer system1000 may be any of various types of devices, including, but not limitedto, a personal computer system, desktop computer, laptop, notebook,tablet, slate, pad, or netbook computer, mainframe computer system,handheld computer, workstation, network computer, a camera, a set topbox, a mobile device, a consumer device, video game console, handheldvideo game device, application server, storage device, a television, avideo recording device, a peripheral device such as a switch, modem,router, or in general any type of computing or electronic device.

Various embodiments of a camera motion control system as describedherein, including embodiments of magnetic position sensing, as describedherein may be executed in one or more computer systems 1000, which mayinteract with various other devices. Note that any component, action, orfunctionality described above with respect to FIGS. 1-9 may beimplemented on one or more computers configured as computer system 1000of FIG. 10 , according to various embodiments. In the illustratedembodiment, computer system 1000 includes one or more processors 1010coupled to a system memory 1020 via an input/output (I/O) interface1030. Computer system 1000 further includes a network interface 1040coupled to I/O interface 1030, and one or more input/output devices1050, such as cursor control device 1060, keyboard 1070, and display(s)1080. In some cases, it is contemplated that embodiments may beimplemented using a single instance of computer system 1000, while inother embodiments multiple such systems, or multiple nodes making upcomputer system 1000, may be configured to host different portions orinstances of embodiments. For example, in one embodiment some elementsmay be implemented via one or more nodes of computer system 1000 thatare distinct from those nodes implementing other elements.

In various embodiments, computer system 1000 may be a uniprocessorsystem including one processor 1010, or a multiprocessor systemincluding several processors 1010 (e.g., two, four, eight, or anothersuitable number). Processors 1010 may be any suitable processor capableof executing instructions. For example, in various embodimentsprocessors 1010 may be general-purpose or embedded processorsimplementing any of a variety of instruction set architectures (ISAs),such as the x86, PowerPC, SPARC, or MIPS ISAs, or any other suitableISA. In multiprocessor systems, each of processors 1010 may commonly,but not necessarily, implement the same ISA.

System memory 1020 may be configured to store program instructions 1022accessible by processor 1010. In various embodiments, system memory 1020may be implemented using any suitable memory technology, such as staticrandom-access memory (SRAM), synchronous dynamic RAM (SDRAM),nonvolatile/Flash-type memory, or any other type of memory.Additionally, existing camera control data 1032 of memory 1020 mayinclude any of the information or data structures described above. Insome embodiments, program instructions and/or data may be received, sentor stored upon different types of computer-accessible media or onsimilar media separate from system memory 1020 or computer system 1000.While computer system 1000 is described as implementing thefunctionality of functional blocks of previous figures, any of thefunctionality described herein may be implemented via such a computersystem.

In one embodiment, I/O interface 1030 may be configured to coordinateI/O traffic between processor 1010, system memory 1020, and anyperipheral devices in the device, including network interface 1040 orother peripheral interfaces, such as input/output devices 1050. In someembodiments, I/O interface 1030 may perform any necessary protocol,timing or other data transformations to convert data signals from onecomponent (e.g., system memory 1020) into a format suitable for use byanother component (e.g., processor 1010). In some embodiments, I/Ointerface 1030 may include support for devices attached through varioustypes of peripheral buses, such as a variant of the Peripheral ComponentInterconnect (PCI) bus standard or the Universal Serial Bus (USB)standard, for example. In some embodiments, the function of I/Ointerface 1030 may be split into two or more separate components, suchas a north bridge and a south bridge, for example. Also, in someembodiments some or all of the functionality of I/O interface 1030, suchas an interface to system memory 1020, may be incorporated directly intoprocessor 1010.

Network interface 1040 may be configured to allow data to be exchangedbetween computer system 1000 and other devices attached to a network1085 (e.g., carrier or agent devices) or between nodes of computersystem 1000. Network 1085 may in various embodiments include one or morenetworks including but not limited to Local Area Networks (LANs) (e.g.,an Ethernet or corporate network), Wide Area Networks (WANs) (e.g., theInternet), wireless data networks, some other electronic data network,or some combination thereof. In various embodiments, network interface1040 may support communication via wired or wireless general datanetworks, such as any suitable type of Ethernet network, for example;via telecommunications/telephony networks such as analog voice networksor digital fiber communications networks; via storage area networks suchas Fibre Channel SANs, or via any other suitable type of network and/orprotocol.

Input/output devices 1050 may, in some embodiments, include one or moredisplay terminals, keyboards, keypads, touchpads, scanning devices,voice or optical recognition devices, or any other devices suitable forentering or accessing data by one or more computer systems 1000.Multiple input/output devices 1050 may be present in computer system1000 or may be distributed on various nodes of computer system 1000. Insome embodiments, similar input/output devices may be separate fromcomputer system 1000 and may interact with one or more nodes of computersystem 1000 through a wired or wireless connection, such as over networkinterface 1040.

As shown in FIG. 10 , memory 1020 may include program instructions 1022,which may be processor-executable to implement any element or actiondescribed above. In one embodiment, the program instructions mayimplement the methods described above. In other embodiments, differentelements and data may be included. Note that data may include any dataor information described above.

Those skilled in the art will appreciate that computer system 1000 ismerely illustrative and is not intended to limit the scope ofembodiments. In particular, the computer system and devices may includeany combination of hardware or software that can perform the indicatedfunctions, including computers, network devices, Internet appliances,PDAs, wireless phones, pagers, etc. Computer system 1000 may also beconnected to other devices that are not illustrated, or instead mayoperate as a stand-alone system. In addition, the functionality providedby the illustrated components may in some embodiments be combined infewer components or distributed in additional components. Similarly, insome embodiments, the functionality of some of the illustratedcomponents may not be provided and/or other additional functionality maybe available.

Those skilled in the art will also appreciate that, while various itemsare illustrated as being stored in memory or on storage while beingused, these items or portions of them may be transferred between memoryand other storage devices for purposes of memory management and dataintegrity. Alternatively, in other embodiments some or all of thesoftware components may execute in memory on another device andcommunicate with the illustrated computer system via inter-computercommunication. Some or all of the system components or data structuresmay also be stored (e.g., as instructions or structured data) on acomputer-accessible medium or a portable article to be read by anappropriate drive, various examples of which are described above. Insome embodiments, instructions stored on a computer-accessible mediumseparate from computer system 1000 may be transmitted to computer system1000 via transmission media or signals such as electrical,electromagnetic, or digital signals, conveyed via a communication mediumsuch as a network and/or a wireless link. Various embodiments mayfurther include receiving, sending or storing instructions and/or dataimplemented in accordance with the foregoing description upon acomputer-accessible medium. Generally speaking, a computer-accessiblemedium may include a non-transitory, computer-readable storage medium ormemory medium such as magnetic or optical media, e.g., disk orDVD/CD-ROM, volatile or non-volatile media such as RAM (e.g. SDRAM, DDR,RDRAM, SRAM, etc.), ROM, etc. In some embodiments, a computer-accessiblemedium may include transmission media or signals such as electrical,electromagnetic, or digital signals, conveyed via a communication mediumsuch as network and/or a wireless link.

The methods described herein may be implemented in software, hardware,or a combination thereof, in different embodiments. In addition, theorder of the blocks of the methods may be changed, and various elementsmay be added, reordered, combined, omitted, modified, etc. Variousmodifications and changes may be made as would be obvious to a personskilled in the art having the benefit of this disclosure. The variousembodiments described herein are meant to be illustrative and notlimiting. Many variations, modifications, additions, and improvementsare possible. Accordingly, plural instances may be provided forcomponents described herein as a single instance. Boundaries betweenvarious components, operations and data stores are somewhat arbitrary,and particular operations are illustrated in the context of specificillustrative configurations. Other allocations of functionality areenvisioned and may fall within the scope of claims that follow. Finally,structures and functionality presented as discrete components in theexample configurations may be implemented as a combined structure orcomponent. These and other variations, modifications, additions, andimprovements may fall within the scope of embodiments as defined in theclaims that follow.

What is claimed is:
 1. A device, comprising: an actuator configured tomove a first component relative to a second component to providemovement between a lens group and an image sensor; a damper arrangementincluding: a viscoelastic material at least partially disposed within avolumetric space that is defined by at least one of the first componentor the second component; and an interface member comprising: a mountingelement of the interface member that extends from the first component orthe second component, and a viscoelastic engagement element of theinterface member fixedly-coupled to the mounting element and thatextends to at least partially into the viscoelastic material to traversewithin the viscoelastic material to dampen motion of the first componentduring operation of the actuator.
 2. The device of claim 1, wherein: themounting element of the interface member that extends from the firstcomponent or the second component comprises a sheet or plate or spring;the viscoelastic engagement element of the interface member coupled tothe mounting element comprises a pin or wire; and the pin or wire iscoupled to the sheet or plate or spring via solder.
 3. The device ofclaim 1, wherein: the mounting element of the interface member thatextends from the first component, or the second component, has a crosssectional area; and the viscoelastic engagement element of the interfacemember coupled to the mounting element has another cross-sectional areathat is less than the cross-sectional area of the mounting element ofthe interface member.
 4. The device of claim 1, wherein: theviscoelastic material in the volumetric space comprises a skin having aviscosity different that the remaining viscoelastic material in thevolumetric space, the skin attached to the viscoelastic engagementelement of the interface member.
 5. The device of claim 1, wherein: themounting element of the interface member is configured to flex with themotion of the second component during operation of the actuator; and themounting element comprises a polymer-based anti-vibration coating todampen oscillation of the mounting element.
 6. The device of claim 1,wherein: the device is a mobile multifunction device; and the devicefurther includes: a display; a camera module, including: the lens group;an image sensor configured to capture light passing through the lensgroup and covert the captured light into image signals; and theactuator; and one or more processors configured to: cause the actuatorto move the second component along, or orthogonal to, the optical axis;and cause the display to present an image based at least in part on oneor more of the image signals from the image sensor.
 7. A camera module,comprising: a lens group that includes one or more lens elements; animage sensor; an actuator configured to move a first component relativeto a second component to provide movement between the lens group and theimage sensor; a damper arrangement including: a viscoelastic material atleast partially disposed within a volumetric space that is defined by atleast one of the first component or the second component; and aninterface member comprising: a mounting element of the interface memberthat extends from the first component or the second component, and aviscoelastic engagement element of the interface member fixedly-coupledto the mounting element and that extends to at least partially into theviscoelastic material to traverse within the viscoelastic material todampen motion of the first component during operation of the actuator.8. The camera module of claim 7, wherein: the mounting element of theinterface member that extends from the first component or the secondcomponent has a cross sectional area; and the viscoelastic engagementelement of the interface member fixedly-coupled to the mounting elementhas another cross-sectional area that is less than the cross-sectionalarea of the mounting element of the interface member.
 9. The cameramodule of claim 7, wherein: the interface member is one of a pluralityof interface members of the damper arrangement; and the plurality ofinterface members include: a first pair of interface members; and asecond pair of interface members opposite the first pair of interfacemembers relative to the lens.
 10. The camera module of claim 9, wherein:the damper arrangement further includes respective viscoelastic materialportions disposed within respective volumetric space; and each interfacemember of the plurality of interface members includes a respectiveportion that is disposed within a respective volumetric space of therespective volumetric spaces.
 11. The camera module of claim 9, wherein:each interface member of the first pair of interface members includes afirst portion that is disposed within the viscoelastic material and thathas a first cross-sectional shape; and each interface member of thesecond pair of interface members has a second portion that is disposedwithin the viscoelastic material and that has a second cross-sectionalshape that is different than the first cross-sectional shape.
 12. Thecamera module of claim 9, wherein: the first pair of interface membersare arranged in a first orientation; and the second pair of interfacemembers are arranged in a second orientation that is different than thefirst orientation.
 13. The camera module of claim 9, wherein: the firstpair of interface members includes: a first interface member that has afirst cross-sectional thickness; and a second interface member that hasa second cross-sectional thickness; wherein at least one of: the firstcross-sectional thickness is different than the second cross-sectionalthickness.
 14. The camera module of claim 7, wherein: the mountingelement of the interface member that extends from the first component orthe second component comprises a sheet or plate or spring; theviscoelastic engagement element of the interface member coupled to themounting element comprises a pin or wire; and the pin or wire is coupledto the sheet or plate or spring via solder.
 15. The camera module ofclaim 7, wherein the viscoelastic material in the volumetric spacecomprises a skin having a viscosity different that the remainingviscoelastic material in the volumetric space, the skin attached to theviscoelastic engagement element of the interface member.
 16. The cameramodule of claim 7, wherein: the mounting element of the interface memberis configured to flex with the motion of the second component duringoperation of the actuator; and the mounting element comprises apolymer-based anti-vibration coating to dampen oscillation of themounting element.
 17. A system, comprising: a lens group that includesone or more lens elements; an image sensor; an actuator configured tomove a first component relative to a second component to providemovement between the lens group and the image sensor; a damperarrangement including: a viscoelastic material at least partiallydisposed within a volumetric space that is defined by at least one ofthe first component or the second component; and an interface membercomprising: a mounting element of the interface member that extends fromthe first component or the second component, and a viscoelasticengagement element of the interface member fixedly-coupled to themounting element and that extends to at least partially into theviscoelastic material to traverse within the viscoelastic material todampen motion of the first component during operation of the actuator;and one or more processors configured to cause the actuator to move thesecond component along, or orthogonal to, the optical axis.
 18. Thesystem of claim 17, wherein: the mounting element of the interfacemember that extends from the first component or the second componentcomprises a sheet or plate or spring; the viscoelastic engagementelement of the interface member coupled to the mounting elementcomprises a pin or wire; and the pin or wire is coupled to the sheet orplate or spring via solder.
 19. The system of claim 17, wherein: themounting element of the interface member is configured to flex with themotion of the second component during operation of the actuator; and themounting element comprises a polymer-based anti-vibration coating todampen oscillation of the mounting element.
 20. The system of claim 19,wherein the viscoelastic material in the volumetric space comprises askin having a viscosity different that the remaining viscoelasticmaterial in the volumetric space, the skin attached to the viscoelasticengagement element of the interface member.